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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial
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Brand Name:NXP
Model Number:LPC1114FHN33/302:5
Certification:CE,ROHS
Price:1$/pcs~1.2$/pcs
Payment Terms:T/T, Western Union,paypal
Supply Ability:10kpcs/month
Delivery Time:2-4 working days after receiving the payment
Company Data
Verified Supplier
Contact Person
Natasha
Business Type:
Manufacturer
Officials:
RM1441,GUO LI Bldg,ZhongHang RD.,Futian Dist.Shen Zhen,China
Quality:
Quality Certifitation Available
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Product Details
Company Profile
Product Details
NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial
Description:
• System:
– ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
– ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
– Serial Wire Debug.
– System tick timer.
• Memory:
– On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C
series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB
(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).
– On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB
(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),
56 kB (LPC1114/333), 64 kB (LPC1115).
– 8 kB, 4 kB, 2 kB, or 1 kB SRAM.
– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
– LPC1100XL series only: page erase IAP command.
• Digital peripherals:
– Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors. Number of GPIO pins is reduced for smaller packages and
LPC11C22/C24.
– GPIO pins can be used as edge and level sensitive interrupt sources.
– High-current output driver (20 mA) on one pin.
– High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
– Four general purpose timers/counters with a total of four capture inputs and up to
13 match outputs.
– Programmable WatchDog Timer (WDT).
• Analog peripherals:
– 10-bit ADC with input multiplexing among up to 8 pins.
• Serial interfaces:
– UART with fractional baud rate generation, internal FIFO, and RS-485 support.
– Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LQFP48 packages only).
– I
2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
– C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.
– On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).
• Clock generation:
– 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used
as a system clock.
– Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 — 10 June 2014 7 of 547
NXP Semiconductors UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
– Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
– PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
– Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
• Power control:
– Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
– Power profiles residing in boot ROM allowing to optimize performance and
minimize power consumption for any given application through one simple function
call. (On LPC1100L and LPC1100XL parts only).
– Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
– Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
– Power-On Reset (POR).
– Brownout detect with up to four separate thresholds for interrupt and forced reset.
• Unique device serial number for identification.
• Single 3.3 V power supply (1.8 V to 3.6 V).
• Available as LQFP48 package, HVQFN33 package.
• LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,
TSSOP20 package, and SO20 package.
• Available as dual-chip module consisting of the LPC1114 single-chip microcontroller
combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part
LPC11D14FBD100/302).1
Specification:
Standard package | 260pcs/tray |
Category | Integrated Circuits (ICs) |
Family | Embedded - Microcontrollers |
Series | LPC1100L |
Packaging | Tray |
Core Processor | ARM® Cortex®-M0 |
Core Size | 32-Bit |
Speed | 50MHz |
Connectivity | I²C, SPI, UART/USART |
Peripherals | Brown-out Detect/Reset, POR, WDT |
Number of I/O | 28 |
Program Memory Size | 32KB (32K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 8K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V |
Data Converters | A/D 8x10b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C |
Package / Case | 32-VQFN Exposed Pad |
Supplier Device Package | 32-HVQFN (7x7) |
Ordering Information:
Type number | Package | Description | Version |
SO20, TSSOP20, TSSOP28, and DIP28 packages |
| ||
LPC1110FD20 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm | SOT163-1 |
LPC1111FDH20/002 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
LPC1112FD20/102 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm | SOT163-1 |
LPC1112FDH20/102 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
LPC1112FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
LPC1114FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
LPC1114FN28/102 | DIP28 | DIP28: plastic dual in-line package; 28 leads (600 mil) | SOT117-1 |
HVQFN24/33, LQFP48, and TFBGA48 packages |
| ||
LPC1111FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1111JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN24/202 | HVQFN24 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | SOT616-3 |
LPC1112FHI33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1112FHI33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1112FHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1112JHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1112FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1112FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHI33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1114JHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
LPC1114FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114FHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1114JHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
LPC1113FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1113FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1113FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1113JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114FBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114JBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114FBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1114JBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1115FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1115JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
LPC1115FET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
LPC1115JET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
Application:
it is used for a Wide range of fields :
Industrial products, communication etc
Product show:
Our advantage :
- High quality products --- our offers are 100% new and original, ROHS
- Competitive price --- good Purchase channels with good price.
- Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
- Adequate inventory --- With the support of our strong Purchasing team,
- Fast delivery --- we will ship the goods within 1-3 working days after the payment confirmed.
be sure to meet your need for all kinds of components. ^_^
Product List
Supply a Series of Electronic Components, full range of semiconductors, active & passive Components.We can help you to get all for bom of the PCB,IN a word, you can get one-stop solution here,
The offers including:
Integrated Circuit, Memory ICs, Diode, Transistor , Capacitor, Resistor, Varistor, Fuse, Trimmer & Potentiometer, Transformer, Battery, Cable, Relay, Switch, Connector, Terminal Block, Crystal & Oscillator, Inductor, Sensor, Transformer, IGBT Driver, LED,LCD, Convertor, PCB (Printed Circuit Board),PCBA (PCB Assembly)
Strong in Brand:
Microchip, MAX, AD, TI, NXP, ATMEL, ST, ON, NS, Intersil, Winbond, Vishay, ISSI, Infineon, NEC, FAIRCHILD, OMRON,YAGEO, TDK, etc
Company Profile
TOP Electronic Industry Co., Ltd.
Thank you for your time to know our company and lean our production.
TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our suppliers and partners, and put our customers in the first place always.
Here we can offer one-stop solution service: from PCB design, production to PCB assembly, from a series of components offer to the BOM list.
In addition to its component supply service, TOP distributes industry respected communication modules(GPS,GSM/GPRS,3G,LTE 4G modules) and accessories. All the brands are very famous and welcome by the customers all over the world, they are including: Sierra Wireless, SIMCOM, CINTERION, U-BLOX, HUAWEI, ZTE,TELIT, HOLUX etc. competitive price, Adequate inventory, fast delivery, be praised by all the customers .
As an innovative company, TOP supplies and markets high-quality wireless communication antennas and RF-cables. to work with modules together. With more than 8 years antenna experience, we win a lot of stable customers from more than 50 countries. In order to save the cost and delivery time, control the quality, supply the competitive price for our customers, we built our own antenna factory in 2012,which is for developing and manufacturing GPS antenna, GSM/GPRS antenna, WIFI antenna, LTE antenna, all kinds of combo antennas etc. Quality, stability, accessibility are all important to us.
The third production-line is Supply a Series of Electronic Components, including Integrated Circuits, Transistor, Diode, LED, LCD display, Capacitor, Resistor, Inductor, Relay, Crystal , Terminal block ,pin header etc.
Our Strong in Brand including Microchip, MAX, AD, TI, NXP, ATMEL, ST, ON, NS, Intersil, Winbond, Vishay, ISSI, Infineon, NEC, FAIRCHILD, OMRON,YAGEO, TDK, etc
As a global distributor of electronic components, we stocking the world's widest range products of semiconductor and electronic components. You can get one stop service here include BOM(bill of material) purchasing, testing, design for your project. Our experienced team is providing the most excellent service to meet your needs and satisfaction.
With rich experience on wireless product and electronic components, we win our customers with good quality and competitive price. We only offer the products 100% original from the factory.
TOP has never stop going forward, we always want to give our customers best service. in 2013, together with our partners, we built another PCB factory. In this factory, we can make design, supply PCB, make PCB SMT and DIP assembly, offer BOM service. As a professional supplier , We have a strong procurement team and are therefore able to provide customers with competitive prices and good quality. This is our advantage to you.
As they are to you. Just as in our name, TOP strives to be a leading business in the electronic industry. Our high quality products and professional service, are sure to meet your need for all kinds of electronic components.
You are searching for creditable and professional supplier to work with; we are also looking for sincerely and long-term customers. Once we find each other, we could make rapid progress together!
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