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Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal

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Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers
  • Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers
  • Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers
  • Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers
  • Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers
  • Buy cheap Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz from wholesalers

Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz

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Brand Name:ZIITEK
Model Number:TIF160-40-10S
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:3-5work days
Company Data
Verified Supplier
Contact Person Dana Dai
Business Type: Manufacturer
Officials: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality: Quality Certifitation Available
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Product Details Company Profile
Product Details

Handheld Portable Electronics Thermal Gap Filler with Adhesive Ceramic Filled Silicone Rubber


The TIF160-40-10S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Good thermal conductive: 4.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF160-40-10S​ Series
Color

Grey

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
45
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77

Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

1.91

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16

120mils / 3.048 mm

2.29

Dielectric Breakdown Voltage
>1500~>5500 VACASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05

200mils / 5.080 mm

3.14

Thermal conductivity
4.0W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz

FACTORY INFORMATION:


Factory Size

5,000-10,000 square meters


Factory Country/Region

Building B8, Industry District , Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China


Annual Output Value

US$1 Million - US$2.5 Million


TIF100-40-10S Series Datasheet-(E)-REV01.pdf































Company Profile

Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

 

Ziitek D-U-N-S® Number: 656191068

 

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